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Printed Circuit Design –
the core of the development process
Many engineering processes converge in the PCB design. Kappa relies on proven in-house expertise. Developers and layout designers work hand-inhand and assure the rapid execution of prototypes as well as redesigns.
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Smaller, lighter, denser
with HDI and Rigid-Flex
To realize a high functional density in compact and light housings we rely on HDI and rigid-flex PCB technology.
High Density Interconnect
HDI (High Density Interconnect) PCBs offer finer lines and smaller vias. The layers are bonded using SBU (Sequential Build Up) technology and the signals are connected on the inner layers, saving space for components with high pin density. Even overlapping positioning
of these components is possible.
Rigid-Flex
Using new rigid-flex PCB technology enables Kappa to achieve optimum
solutions in confined spaces. This technology is especially appropriate when dealing with flexible parts. Another advantage of the flex connectors is the elimination of interference caused by connectors in HF applications.
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